Many companies are heading in the direction of stacking chips -- also called 3D structuring -- on top of each other to save space and improve throughput. But the memory units in Knights Landing may not be stacked as it could be expensive and cause more leakage, Kanter said.
"Stacking memory on top makes sense, but if you have a 200- to 300-watt chip under it, doesn't make sense," Kanter said.
A big improvement on Knights Landing is support for single-threaded applications, Kanter said. Accelerator chips today focus mostly on highly parallel applications, leaving single threaded applications hanging to be processed by other hardware units. Such computing can be inefficient, Kanter said.
Also, developers won't have to worry about writing code in which processing is redirected to different hardware, analysts said.
Knights Landing will be made using the 14-nanometer manufacturing process. The first 14-nm chips are expected to reach PCs in the second half of this year, and Knights Landing could follow.