Taiwanese DRAM maker ups equipment spending

ProMOS to spend $850 million on new plants

Taiwanese DRAM (dynamic RAM) chip maker ProMOS Technologies Inc. plans to spend $850 million on new plants and equipment next year, mainly advanced 12-inch (300-millimeter) wafer production equipment, an executive said Thursday.

The wafer technology enables chip makers to produce more chips on each 12-inch round silicon wafer than they could on older, 8-inch (200-millimeter) wafers. The result is about a 30 percent reduction in manufacturing costs.

The projected spending next year would be higher than 2005's forecasted $700 million, said Min-Liang Chen, ProMOS's chairman, during a meeting with reporters in Taipei.

ProMOS operates two of the huge 12-inch chip plants in Taiwan. One of the plants just started test production and has already produced chips using tiny 90-nanometer etching. Chen projected it would reach output of around 30,000 wafers per month by the middle of next year. Thousands of chips can be etched onto each wafer.

From CIO: 8 Free Online Courses to Grow Your Tech Skills
Join the discussion
Be the first to comment on this article. Our Commenting Policies