To accomplish anything in the suburbs, you need to get in your car and drive to another address. Downtown, in a skyscraper, you just use an elevator.
Elevators are more efficient -- and the semiconductor industry has taken notice (metaphorically speaking) with a trend toward 3D chip design. Instead of putting dies in separate packages, soldered to a circuit board and sending data through their I/O ports to other chips (i.e., driving through the suburbs), dies are stacked and data is moved from one layer to the next (i.e., via the elevator).
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Chip industry insiders, such as Brian Cronquist, vice president at Monolithic 3D Inc., a 3D chip technology startup in San Jose, say that a 3D design using two stacked dies with 22-nanometer geometry would produce much the same result -- including reduced wire length, gate size and device power consumption -- as moving to one die with 15nm geometry. (According to Intel , a 22nm transistor's gates are so small that over 4,000 of them could fit across the width of a single human hair.)
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